GB/T 45713.4-2025

Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices

NORMA vydána dne 30.5.2025

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The information about the standard:

Designation standards: GB/T 45713.4-2025
Publication date standards: 30.5.2025
Country: Chinese technical standard
Kategorie: Technické normy GB