GB/T 43536.2-2023

Three dimensional integrated circuits—Part 2Alignment of stacked dies having fine pitch interconnect

NORMA vydána dne 28.12.2023

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The information about the standard:

Designation standards: GB/T 43536.2-2023
Publication date standards: 28.12.2023
Country: Chinese technical standard
Kategorie: Technické normy GB