Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
NORMA vydána dne 30.7.2026
Designation standards: GB/T 15879.603-2026
Note: K dispozici od: únor 2027
Publication date standards: 30.7.2026
Country: Chinese technical standard
Kategorie: Technické normy GB