E DIN IEC 60191-6-9:2002-07

Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP).

NORMA vydána dne 1.7.2002

The information about the standard:

Designation standards: E DIN IEC 60191-6-9:2002-07
Note: NEPLATNÁ
Publication date standards: 1.7.2002
The number of pages: 33
Approximate weight : 99 g (0.22 lbs)
Country: German technical standard
Kategorie: Technické normy DIN