Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly.
NORMA vydána dne 31.7.2007
Designation standards: BS EN 61190-1-2:2007
Note: NEPLATNÁ
Publication date standards: 31.7.2007
The number of pages: 22
Approximate weight : 66 g (0.15 lbs)
Country: British technical standard
Kategorie: Technické normy BS