ASTM F584-06e1

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015) (Includes all amendments And changes 1/16/2015).

NORMA vydána dne 1.1.2006

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The information about the standard:

Designation standards: ASTM F584-06e1
Note: NEPLATNÁ
Publication date standards: 1.1.2006
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM

Annotation of standard text ASTM F584-06e1 :

Keywords:
bonding wire, inspection, lead-bonding wire, semiconductor packaging, visual inspection, wire, ICS Number Code 29.060.10 (Wires)