ASTM F72-95

Standard Specification for Gold Wire for Semiconductor Lead Bonding

NORMA vydána dne 1.1.2001

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The information about the standard:

Designation standards: ASTM F72-95
Note: NEPLATNÁ
Publication date standards: 1.1.2001
The number of pages: 13
Approximate weight : 39 g (0.09 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM

Annotation of standard text ASTM F72-95 :

Keywords:
gold wire, semiconductor, internal, electrical connections, copper-modified wire, beryllium-modified wire, high-strength wire, special purpose wire, lead bonding, thermal stability, high purity gold wire