Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates (Withdrawn 2008)
NORMA vydána dne 10.12.2002
Designation standards: ASTM F692-97(2002)
Note: NEPLATNÁ
Publication date standards: 10.12.2002
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
adhesion strength, metallization, solderable thick film, ICS Number Code 25.160.50 (Brazing and soldering)