Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)
NORMA vydána dne 1.4.2013
Designation standards: ASTM F677-13
Note: NEPLATNÁ
Publication date standards: 1.4.2013
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
electronic, encapsulating compound, grease, microelectronics, ICS Number Code 31.020 (Electronic components in general)