Standard Test Method for Measuring Warp and Total Thickness Variation on Silicon Wafers by Noncontact Scanning (Withdrawn 2003)
NORMA vydána dne 1.1.1999
Designation standards: ASTM F657-92(1999)
Note: NEPLATNÁ
Publication date standards: 1.1.1999
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
Nondestructive evaluation (NDE)-semiconductors, Thickness-semiconductors, Total thickness, TTV (total thickness variation), Warp-semiconductors, warp/total thickness variation-silicon wafers, by noncontact scanning,, test,, Silicon-semiconductor applications, wafers-warp/total thickness variation (TTV), by noncontact scanning,, test, ICS Number Code 29.045 (Semiconducting materials)