Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Includes all amendments And changes 3/2/2021).
NORMA vydána dne 1.1.2001
Designation standards: ASTM F638-88(1995)e1
Note: NEPLATNÁ
Publication date standards: 1.1.2001
The number of pages: 3
Approximate weight : 9 g (0.02 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
magnesium aluminum wire, wire bonding