
Standard Practice for Determining Solderability of Thick Film Conductors (Includes all amendments And changes 3/2/2021).
NORMA vydána dne 1.1.1991
Designation standards: ASTM F357-78(1997)e1
Note: NEPLATNÁ
Publication date standards: 1.1.1991
The number of pages: 2
Approximate weight : 6 g (0.01 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
hybrid microcircuits, solderability, solder wetting, thick-film metallization