
Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric] (Withdrawn 2009)
NORMA vydána dne 10.6.1996
Designation standards: ASTM F1260M-96(2003)
Note: NEPLATNÁ
Publication date standards: 10.6.1996
The number of pages: 8
Approximate weight : 24 g (0.05 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
electromigration, electromigration metallization, integrated circuit, microelectronics, open circuit, resistance increase, time-to-failure