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ASTM D5213-26

Standard Specification for Polymeric Resin Film for Electrical Insulation and Dielectric Applications

NORMA vydána dne 1.9.2026

Anglicky -
Online zabezpečené PDF (1569.90 CZK)

Anglicky -
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The information about the standard:

Designation standards: ASTM D5213-26
Publication date standards: 1.9.2026
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM

Annotation of standard text ASTM D5213-26 :

This specification establishes the requirements for the material, dimensions and tolerances, and property values of polymeric resin films, in sheet or strip form, for use in electrical insulation and dielectric applications. Type I are flexible unsupported films for general purpose, while Type II are heat-sealable coated on one (Grade 1) or both (Grade 2) sides. Materials covered here are (A) poly(N,N´-p,p´-oxydiphenylene pyromellitimide), (B) poly(N,N´-p,p´-oxydiphenylene biphenyltetracarboxylimide, (C) poly(N,N´-p-phenylene biphenyltetracarboxylimide), (D) FEP-fluorocarbon, (E) polyethylene terephthalate, (F) polyethylene naphthalate, and (G) polyetherimide. Individual materials class of films shall be tested and conform accordingly the following property values: tensile strength; elongation; shrinkage; moisture absorption; dielectric strength; volume resistivity; permittivity; and dissipation factor.


Keywords:
conditioning, dielectric strength, dissipation factor, elongation, FEP fluorocarbon, film, fluorinated poly(ethylene-propylene), heat-seal strength, heat-sealable, permittivity, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyimide, poly(N, N`-p, p`-oxydiphenylene biphenyltetracarboxylimide), poly(N, N`-p, p`-oxydiphenylene pyromellitimide), poly(N, N`-p-phenylene biphenyltetra-carboxylimide), shrinkage, tensile strength, thickness, volume resistivity,