Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

Informace o normě:

Označení normy: ASTM D5109-12
Poznámka: NEPLATNÁ
Datum vydání normy: 1.11.2012
Počet stran: 9
Přibližná hmotnost: 27 g (0.06 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM

Anotace textu normy ASTM D5109-12 :

Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)