Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)

Informace o normě:

Označení normy: ASTM B579-73(2009)
Poznámka: NEPLATNÁ
Datum vydání normy: 1.9.2009
Počet stran: 5
Přibližná hmotnost: 15 g (0.03 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM

Anotace textu normy ASTM B579-73(2009) :

Keywords:
electrodeposited coatings, tin-lead alloy (solder plate), solder, tin-lead alloy, tin-lead, Artificial aging, Bend testing--coatings, Burnishing test--for coating adhesion, Coating adhesion--electrodeposited coatings, Copper alloy electrodeposited coatings, Dip test, Electrodeposited Sn coatings--specifications, Globule test, Iron products (general)--electrodeposited coatings, Lead-tin alloys/coatings--specifications, Printed circuits, Quenching, Reflow test