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ASTM Volume 10.04 - Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies
Přeložit název
PUBLIKACE vydána dne 1.4.2018
Dostupnost | Vyprodáno |
Cena | NA DOTAZ bez DPH |
NA DOTAZ |
Označení: ASTM Volume 10.04 - Electronics; Declarable Substances in Materials; 3D Imaging Systems; Additive Manufacturing Technologies
Počet stran: 1064
Přibližná hmotnost: 3223 g (7.11 liber)
Datum vydání: 1.4.2018
Země: Americká publikace
Volume 10.04 covers standards on electronics, including:
• Innerlayer interconnections and bonding
• Materials and processes for vacuum tubes
• Electronic device characterization
• Hermetic seals
• Hybrid circuits and substrates
• Microelectronic packaging
• Leak testing
• And more This volume also includes the latest standards relating to:
• Declarable substances in materials
• 3D imaging systems
• Additive manufacturing technologies
E2544-11a(2019) | Standard Terminology for Three-Dimensional (3D) Imaging Systems |
E2641-09(2017) | Standard Practice for Best Practices for Safe Application of 3D Imaging Technology |
E2807-11(2019) | Standard Specification for 3D Imaging Data Exchange, Version 1.0 |
E2919-14 | Standard Test Method for Evaluating the Performance of Systems that Measure Static, Six Degrees of Freedom (6DOF), Pose |
E2938-15 | Standard Test Method for Evaluating the Relative-Range Measurement Performance of 3D Imaging Systems in the Medium Range |
E3064-16 | Standard Test Method for Evaluating the Performance of Optical Tracking Systems that Measure Six Degrees of Freedom (6DOF) Pose |
E3124-17 | Standard Test Method for Measuring System Latency Performance of Optical Tracking Systems that Measure Six Degrees of Freedom (6DOF) Pose |
E3125-17 | Standard Test Method for Evaluating the Point-to-Point Distance Measurement Performance of Spherical Coordinate 3D Imaging Systems in the Medium Range |
F7-95(2016) | Standard Specification for Aluminum Oxide Powder |
F15-04(2017) | Standard Specification for Iron-Nickel-Cobalt Sealing Alloy |
F16-12(2017) | Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps |
F18-12(2017) | Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices |
F19-11(2016) | Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals |
F29-97(2017) | Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications |
F30-96(2017) | Standard Specification for Iron-Nickel Sealing Alloys |
F31-16 | Standard Specification for Nickel-Chromium-Iron Sealing Alloys |
F44-16 | Standard Specification for Metallized Surfaces on Ceramic |
F72-17 | Standard Specification for Gold Wire for Semiconductor Lead Bonding |
F73-96(2017) | Standard Specification for Tungsten-Rhenium Alloy Wire for Electron Devices and Lamps |
F76-08(2016)e1 | Standard Test Methods for Measuring Resistivity and Hall Coefficient and Determining Hall Mobility in Single-Crystal Semiconductors |
F83-71(2013) | Standard Practice for Definition and Determination of Thermionic Constants of Electron Emitters |
F85-76(2013) | Standard Practice for Nomenclature for Wire Leads Used as Conductors in Electron Tubes |
F96-77(2015) | Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms |
F106-12(2017) | Standard Specification for Brazing Filler Metals for Electron Devices |
F180-94(2015) | Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices |
F204-76(2013) | Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire |
F205-94(2015) | Standard Test Method for Measuring Diameter of Fine Wire by Weighing |
F219-96(2013) | Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps |
F256-05(2015) | Standard Specification for Chromium-Iron Sealing Alloys with 18 or 28 Percent Chromium |
F269-60(2014) | Standard Test Method for Sag of Tungsten Wire |
F288-96(2014) | Standard Specification for Tungsten Wire for Electron Devices and Lamps |
F289-96(2014) | Standard Specification for Molybdenum Wire and Rod for Electronic Applications |
F290-94(2015) | Standard Specification for Round Wire for Winding Electron Tube Grid Laterals |
F364-96(2014) | Standard Specification for Molybdenum Flattened Wire for Electron Tubes? |
F375-89(2015) | Standard Specification for Integrated Circuit Lead Frame Material |
F390-11 | Standard Test Method for Sheet Resistance of Thin Metallic Films With a Collinear Four-Probe Array |
F448-11 | Test Method for Measuring Steady-State Primary Photocurrent |
F458-13(2018) | Standard Practice for Nondestructive Pull Testing of Wire Bonds1,2 |
F459-13(2018) | Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds |
F487-13(2018) | Standard Specification for Fine Aluminum–1?% Silicon Wire for Semiconductor Lead-Bonding |
F615M-95(2013) | Standard Practice for Determining Safe Current Pulse-Operating Regions for Metallization on Semiconductor Components (Metric) |
F744M-16 | Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) |
F773M-16 | Standard Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric) |
F980-16 | Standard Guide for Measurement of Rapid Annealing of Neutron-Induced Displacement Damage in Silicon Semiconductor Devices |
F996-11(2018) | Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift Into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics |
F1094-87(2012) | Standard Test Methods for Microbiological Monitoring of Water Used for Processing Electron and Microelectronic Devices by Direct Pressure Tap Sampling Valve and by the Presterilized Plastic Bag Method |
F1190-11 | Standard Guide for Neutron Irradiation of Unbiased Electronic Components |
F1192-11(2018) | Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices |
F1238-95(2011) | Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications |
F1262M-14 | Standard Guide for Transient Radiation Upset Threshold Testing of Digital Integrated Circuits (Metric) |
F1263-11 | Standard Guide for Analysis of Overtest Data in Radiation Testing of Electronic Parts |
F1269-13(2018) | Standard Test Methods for Destructive Shear Testing of Ball Bonds |
F1367-98(2011) | Standard Specification for Chromium Sputtering Targets for Thin Film Applications |
F1372-93(2012) | Standard Test Method for Scanning Electron Microscope (SEM) Analysis of Metallic Surface Condition for Gas Distribution System Components |
F1373-93(2012) | Standard Test Method for Determination of Cycle Life of Automatic Valves for Gas Distribution System Components |
F1374-92(2012) | Standard Test Method for Ionic/Organic Extractables of Internal Surfaces-IC/GC/FTIR for Gas Distribution System Components |
F1375-92(2012) | Standard Test Method for Energy Dispersive X-Ray Spectrometer (EDX) Analysis of Metallic Surface Condition for Gas Distribution System Components |
F1376-92(2012) | Standard Guide for Metallurgical Analysis for Gas Distribution System Components |
F1394-92(2012) | Standard Test Method for Determination of Particle Contribution from Gas Distribution System Valves |
F1396-93(2012) | Standard Test Method for Determination of Oxygen Contribution by Gas Distribution System Components |
F1397-93(2012) | Standard Test Method for Determination of Moisture Contribution by Gas Distribution System Components |
F1398-93(2012) | Standard Test Method for Determination of Total Hydrocarbon Contribution by Gas Distribution System Components |
F1438-93(2012) | Standard Test Method for Determination of Surface Roughness by Scanning Tunneling Microscopy for Gas Distribution System Components |
F1466-99(2015) | Standard Specification for Iron-Nickel-Cobalt Alloys for Metal-to-Ceramic Sealing Applications |
F1467-11 | Standard Guide for Use of an X-Ray Tester (?10 keV Photons) in Ionizing Radiation Effects Testing of Semiconductor Devices and Microcircuits |
F1512-94(2011) | Standard Practice for Ultrasonic C-Scan Bond Evaluation of Sputtering Target-Backing Plate Assemblies |
F1513-99(2011) | Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications |
F1578-07(2014) | Standard Test Method for Contact Closure Cycling of a Membrane Switch |
F1593-08(2016) | Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer |
F1594-95(2011) | Standard Specification for Pure Aluminum (Unalloyed) Source Material for Vacuum Coating Applications |
F1595-00(2012) | Standard Practice for Viewing Conditions for Visual Inspection of Membrane Switches |
F1596-15 | Standard Test Method for Exposure of a Membrane Switch or Printed Electronic Device to Temperature and Relative Humidity |
F1598-95(2014) | Standard Test Method for Determining the Effects of Chemical/Solvent Exposure to a Membrane Switch/Graphic Overlay (Spot Test Method) |
F1661-09(2015) | Standard Test Method for Determining the Contact Bounce Time of a Membrane Switch |
F1662-16 | Standard Test Method for Verifying the Specified Dielectric Withstand Voltage and Determining the Dielectric Breakdown Voltage of a Membrane Switch or Printed Electronic Device |
F1663-15 | Standard Test Method for Determining the Capacitance of a Membrane Switch or Printed Electronic Device |
F1680-07a(2014) | Standard Test Method for Determining Circuit Resistance of a Membrane Switch |
F1681-14 | Standard Test Method for Determining Current Carrying Capacity of a Membrane Switch Circuit |
F1683-09 | Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component |
F1684-06(2016) | Standard Specification for Iron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications |
F1689-05(2012) | Standard Test Method for Determining the Insulation Resistance of a Membrane Switch |
F1709-97(2016) | Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications |
F1710-08(2016) | Standard Test Method for Trace Metallic Impurities in Electronic Grade Titanium by High Mass-Resolution Glow Discharge Mass Spectrometer |
F1711-96(2016) | Standard Practice for Measuring Sheet Resistance of Thin Film Conductors for Flat Panel Display Manufacturing Using a Four-Point Probe Method |
F1761-00(2011) | Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets |
F1762-14 | Standard Test Method for Determining the Effects of Atmospheric Pressure Variation on a Membrane Switch |
F1812-15 | Standard Test Method for Determining the Effect of an ESD Discharge on a Membrane Switch or Printed Electronic Device |
F1842-15 | Standard Test Method for Determining Ink or Coating Adhesion on Flexible Substrates for a Membrane Switch or Printed Electronic Device |
F1843-15 | Standard Practice for Sample Preparation of Plastic Films used on Membrane Switch Overlays for Specular Gloss Measurements |
F1844-97(2016) | Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage |
F1845-08(2016) | Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Resolution Glow Discharge Mass Spectrometer |
F1892-12(2018) | Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices |
F1893-11 | Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices |
F1894-98(2011) | Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness |
F1895-14 | Standard Test Method for Submersion of a Membrane Switch |
F1896-16 | Test Method for Determining the Electrical Resistivity of a Printed Conductive Material |
F1995-13 | Standard Test Method for Determining the Shear Strength of the Bond between a Surface Mount Device (SMD) and Substrate in a Membrane Switch |
F1996-14 | Standard Test Method for Silver Migration for Membrane Switch Circuitry |
F2072-14 | Standard Test Method for Hosedown of a Membrane Switch |
F2073-14 | Standard Test Method for Non-Destructive Short Circuit Testing of a Membrane Switch |
F2112-02(2011) | Standard Terminology for Membrane Switches |
F2113-01(2011) | Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications |
F2187-02(2011) | Standard Test Method for Determining the Effect of Random Frequency Vibration on a Membrane Switch or Membrane Switch Assembly |
F2188-02(2011) | Standard Test Method for Determining the Effect of Variable Frequency Vibration on a Membrane Switch or Membrane Switch Assembly |
F2359-04(2011) | Standard Test Method for Determining Color of a Membrane Switch Backlit with Diffuse Light Source |
F2360-08(2015)e1 | Standard Test Method for Determining Luminance of a Membrane Switch Backlit with Diffuse Light Source |
F2405-04(2011) | Standard Test Method for Trace Metallic Impurities in High Purity Copper by High-Mass-Resolution Glow Discharge Mass Spectrometer |
F2576-15a | Standard Terminology Relating to Declarable Substances in Materials |
F2577-14 | Standard Guide for Assessment of Materials and Products for Declarable Substances |
F2592-16 | Standard Test Method for Measuring the Force-Displacement of a Membrane Switch |
F2617-15 | Standard Test Method for Identification and Quantification of Chromium, Bromine, Cadmium, Mercury, and Lead in Polymeric Material Using Energy Dispersive X-ray Spectrometry |
F2725-11 | Standard Guide for European Unions Registration, Evaluation, and Authorization of Chemicals (REACH) Supply Chain Information Exchange |
F2749-15 | Standard Test Method for Determining the Effects of Creasing a Membrane Switch or Printed Electronic Device |
F2750-16 | Standard Test Method for Determining the Effects of Bending a Membrane Switch or Printed Electronic Device |
F2771-10(2016) | Standard Test Method for Determining the Luminance Curve of an Electroluminescent Lamp at Ambient Conditions |
F2853-10(2015) | Standard Test Method for Determination of Lead in Paint Layers and Similar Coatings or in Substrates and Homogenous Materials by Energy Dispersive X-Ray Fluorescence Spectrometry Using Multiple Monochromatic Excitation Beams |
F2865-13 | Standard Guide for Classifying the Degrees of Ingress of Dust and Water into a Membrane Switch |
F2866-11 | Standard Test Method for Flammability of a Membrane Switch in Defined Assembly |
F2924-14 | Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium with Powder Bed Fusion |
F2931-17 | Standard Guide for Analytical Testing of Substances of Very High Concern in Materials and Products |
F2964-12 | Standard Test Method for Determining the Uniformity of the Luminance of an Electroluminescent Lamp or Other Diffuse Lighting Device |
F2971-13 | Standard Practice for Reporting Data for Test Specimens Prepared by Additive Manufacturing |
F2980-13(2017) | Standard Test Method for Analysis of Heavy Metals in Glass by Field Portable X-Ray Fluorescence (XRF) |
F3001-14 | Standard Specification for Additive Manufacturing Titanium-6 Aluminum-4 Vanadium ELI (Extra Low Interstitial) with Powder Bed Fusion |
F3049-14 | Standard Guide for Characterizing Properties of Metal Powders Used for Additive Manufacturing Processes |
F3055-14a | Standard Specification for Additive Manufacturing Nickel Alloy (UNS N07718) with Powder Bed Fusion |
F3056-14e1 | Standard Specification for Additive Manufacturing Nickel Alloy (UNS N06625) with Powder Bed Fusion |
F3078-15 | Standard Test Method for Identification and Quantification of Lead in Paint and Similar Coating Materials using Energy Dispersive X-ray Fluorescence Spectrometry (EDXRF) |
F3091/F3091M-14 | Standard Specification for Powder Bed Fusion of Plastic Materials |
F3122-14 | Standard Guide for Evaluating Mechanical Properties of Metal Materials Made via Additive Manufacturing Processes |
F3139-15 | Standard Test Method for Analysis of Tin-Based Solder Alloys for Minor and Trace Elements Using Inductively Coupled Plasma Atomic Emission Spectrometry |
F3147-15 | Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend |
F3152-16 | Standard Test Method for Determining Abrasion Resistance of Inks and Coatings on Substrates Using Dry or Wet Abrasive Medium |
F3166-16 | Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization |
F3184-16 | Standard Specification for Additive Manufacturing Stainless Steel Alloy (UNS S31603) with Powder Bed Fusion |
F3187-16 | Standard Guide for Directed Energy Deposition of Metals |
F3192-16 | Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization |
F3213-17 | Standard for Additive Manufacturing – Finished Part Properties – Standard Specification for Cobalt-28 Chromium-6 Molybdenum via Powder Bed Fusion |
F3290-17 | Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure |
F3291-17 | Standard Test Method for Measuring the Force-Resistance of a Membrane Force Sensor |
ISO/ASTM52900-15 | Standard Terminology for Additive Manufacturing – General Principles – Terminology |
ISO/ASTM52901-16 | Standard Guide for Additive Manufacturing – General Principles – Requirements for Purchased AM Parts |
ISO/ASTM52910-17 | Standard Guidelines for Design for Additive Manufacturing |
ISO/ASTM52915-16 | Standard Specification for Additive Manufacturing File Format (AMF) Version 1.2 |
ISO/ASTM52921-13 | Standard Terminology for Additive Manufacturing-Coordinate Systems and Test Methodologies |
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